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 JAR Associates, Inc.
    Engineering the Future




Other JAR Electronics Projects

  • Development of a Custom User Interface for Modeling Circuit Breakers for GE
  • Power Spectral Density Analysis of a Ruggedized Computer Housing
  • Printed Circuit Board Thermal and Interconnection Analysis
  • Flow Analysis of a Pin Finned Head Exchanger
  • Nonlinear Analysis of a Keyboard Actuator Spring
  • Stress Analysis of PC Board C-Connectors
  • Strength Analysis of an Office Environment Computer Housing
  • Populated PC Board Thermal Analysis
  • PC Board Interconnection Component Analysis
  • Thermal Analysis of the Exodus System, a Computer Communications Interface


© JAR Associates, Inc. 2013